Job Title: COMSOL Simulation Engineer – High-Temperature Semiconductor Processes

About the Role:

We're looking for a driven simulation engineer to lead the development and analysis of high-temperature processes in semiconductor material systems using COMSOL Multiphysics. The ideal candidate will play a pivotal role in simulating thermal, fluid, and structural behavior at micro and macro scales—helping shape the future of advanced semiconductor design and fabrication.

Key Responsibilities:

• Build and validate multiphysics models involving thermal transport, phase change, and chemical reactions in semiconductor materials.
• Simulate thermal budgets, material stress, and heat diffusion in processing steps such as annealing, epitaxy, and oxidation.
• Collaborate with material scientists and process engineers to optimize equipment configurations and process parameters.
• Analyze simulation outputs to guide experimental design and manufacturing decision-making.
• Develop custom modules using COMSOL’s Application Builder for internal use.
• Maintain documentation and present findings to cross-functional teams.

Required Skills and Qualifications:

• Strong experience with COMSOL Multiphysics, especially modules involving Heat Transfer, Semiconductor, and Chemical Reaction Engineering.
• Bachelor's degree or higher in Materials Science, Mechanical Engineering, Physics, or related field.
• Solid understanding of semiconductor device fabrication and high-temperature phenomena (e.g., dopant diffusion, stress-induced defects).
• Familiarity with meshing techniques, boundary conditions, and solver optimization.
• Experience in MATLAB or Python for data post-processing and scripting.
• Excellent communication and technical writing skills.

Preferred Qualifications:

• Hands-on experience with semiconductor fabrication (cleanroom processes, CVD, ion implantation).
• Knowledge of emerging materials (e.g., GaN, SiC, Ge) and next-gen thermal management approaches.
• Prior work with COMSOL API or LiveLink™ for integration with CAD or other software.